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Your search returned 11 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing
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Year : 2003 Volume number : 26 Issue: 04 |
Electrical Test Strategies For A Wafer-Level Packaging Technology
(Article)
Subject:
Interconnections
,
Packaging
,
Testing
,
Wafer Level Package
Author:
David C.
Keezer
Chirag S.
Patel
Muhannad S.
Bakir
Qing
Zhou
page:
267
-
272
Comparative Study Of Fluid Dispensing Modeling
(Article)
Subject:
Computational Fluid Dynamics
,
Dispenser
,
Flow Rates
,
Nonnewtonian Viscosity
Author:
Yi-Ping
Hong
Han-Xiong
Li
page:
273
-
280
Design And Fabrication Of An Ic Encapsulation Mold Adhesion Force Tester
(Article)
Subject:
Adhesion Force
,
Emc
,
Ic Packaging
,
Fabrication
Author:
Shyang-Jye
Chang
Sheng-Jye
Hwang
page:
281
-
285
Off-Line Control Of Time-Pressure Dispensing Processes For Electronics Packaging
(Article)
Subject:
Electronic Packaging
,
Model Updating
,
Off-Line Control
,
Time-Dependent Fluid Behavior
Author:
X. B
Chen
W.J.
Zhang
G.
Schoenau
B.
Surgenor
page:
286
-
293
Partial Discharge Testing Of Solder Fillets Onpcbs In A Partial Vacuum: New Experimental Results
(Article)
Subject:
Partial Discharges
,
Printed Circuit Board
,
High Voltage Systems
,
Solder Fillets
Author:
Lorenzo
Capineri
Gabriele
Dainelli
Maurizio
Materassi
Barrie D.
Dunn
page:
294
-
304
Evaluation Of Selected Japanese Lead-Free Consumer Electronics
(Article)
Subject:
Circuit Cards
,
Eds
,
"Green" Labels
,
Icp-Aes
Author:
Yuki
Fukuda
Michael
Pecht
Paul
Casey
page:
305
-
312
Processing And Reliability Of Csps With Underfill
(Article)
Subject:
Chip Scale Package
,
Drop Test
,
Underfill
,
Processing
Author:
Jing
Liu
R. Wayne
Johnson
Erin
Yaeger
Larry
Crane
page:
313
-
319
An Investigation Of Bulk Recycling Planning For An Electronics Recycling Facility Receiving Industrial Returns Versus Residential Returns
(Article)
Subject:
Bulk Recyclilng
,
Electronics Product Take-Back
,
Industrial Returns
,
Production Planning
Author:
Ann
Stuart
Qin
Lu
page:
320
-
327
New Quality Cost Models To Optimize Inspection Strategies
(Article)
Subject:
Assemblies
,
Mathematical Models
,
Spc
,
Defect Rates
Author:
Martin
Oppermann
Wilfried
Sauer
Heinz
Wohlrabe
Thomas
Zerna
page:
328
-
337
Genetic Algorithms Applied To Optimal Tolerance Levels Of Multiattribute Inspection Errors
(Article)
Subject:
Genetic Algorithm
,
Coo
,
Multiattributes Inspection
,
Optimal Error Levels
Author:
So Young
Sohn
Yuoung Uk
Moon
page:
338
-
344
Surface Property Of Passivation Layer On Integrated Circuit Chip And Solder Mask Layer On Printed Circuit Board
(Article)
Subject:
Contact Angle
,
Passivation
,
Surface Tension
,
Surface Treatment
Author:
Shijian
Luo
C. P.
Wong
page:
345
-
351
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